Via for Semiconductor Device Connection and Methods of Forming the Same

ABSTRACT

A method for forming a via in a semiconductor device and a semiconductor device including the via are disclosed. In an embodiment, the method may include bonding a first terminal and a second terminal of a first substrate to a third terminal and a fourth terminal of a second substrate; separating the first substrate to form a first component device and a second component device; forming a gap fill material over the first component device, the second component device, and the second substrate; forming a conductive via extending from a top surface of the gap fill material to a fifth terminal of the second substrate; and forming a top terminal over a top surface of the first component device, the top terminal connecting the first component device to the fifth terminal of the second substrate through the conductive via.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/630,673, filed on Feb. 14, 2018, entitled “Semiconductor Device Viaand Methods of Forming the Same,” which patent application isincorporated herein by reference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as, for example, personal computers, cell phones, digital cameras,and other electronic equipment. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductor layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. However,reducing minimum feature sizes leads to additional problems that shouldbe addressed.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 14 illustrate cross-sectional views of intermediatestages in the formation of a package integrated with component devices,in accordance with some embodiments.

FIGS. 15 through 23 illustrate cross-sectional views of intermediatestages in the formation of a package integrated with component devices,in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Packages including device dies integrated with component devices and themethod of forming the same are provided in accordance with variousexemplary embodiments. The intermediate stages of forming some packagesare illustrated in accordance with some embodiments. Some variations ofsome embodiments are discussed. Throughout the various views andillustrative embodiments, like reference numbers are used to designatelike elements.

FIGS. 1 through 14 illustrate the cross-sectional views of intermediatestages in the formation of a package in accordance with some embodimentsof the present disclosure.

FIG. 1 illustrates a cross-sectional view of a first wafer 100 inaccordance with various embodiments. In an embodiment, the first wafer100 comprises a substrate 101 having an electrical circuit formedthereon (represented by element 103 in FIG. 1). The substrate 101 maycomprise, for example, bulk silicon, doped or undoped, or an activelayer of a semiconductor-on-insulator (SOI) substrate. Generally, an SOIsubstrate comprises a layer of a semiconductor material, such assilicon, formed on an insulator layer. The insulator layer may be, forexample, a buried oxide (BOX) layer or a silicon oxide layer. Theinsulator layer is provided on a substrate, which is typically a siliconor glass substrate. Other substrates, such as a multi-layered orgradient substrate may also be used.

The electrical circuit 103 formed on the substrate 101 may be any typeof circuitry suitable for a particular application. In an embodiment,the electrical circuit 103 includes electrical devices formed on thesubstrate 101 with one or more dielectric layers overlying theelectrical devices. Metal layers may be formed between dielectric layersto route electrical signals between the electrical devices. Electricaldevices may also be formed in one or more dielectric layers.

For example, the electrical circuit 103 may include various N-typemetal-oxide semiconductor (NMOS) and/or P-type metal-oxide semiconductor(PMOS) devices, such as transistors, capacitors, resistors, diodes,photo-diodes, fuses, and the like, interconnected to perform one or morefunctions. The functions may include memory structures, processingstructures, sensors, amplifiers, power distribution, input/outputcircuitry, or the like. One of ordinary skill in the art will appreciatethat the above examples are provided for illustrative purposes only tofurther explain applications of the present invention and are not meantto limit the present invention in any manner. Other circuitry may beused as appropriate for a given application.

FIG. 1 also shows an inter-layer dielectric (ILD) layer 105. The ILDlayer 105 may be formed, for example, of a low-K dielectric material,such as phosphosilicate glass (PSG), borophosphosilicate glass (BPSG),FSG, SiO_(x)C_(y), Spin-On-Glass, Spin-On-Polymers, silicon carbonmaterial, compounds thereof, composites thereof, combinations thereof,or the like, by any suitable method known in the art, such as spinning,chemical vapor deposition (CVD), and plasma-enhanced CVD (PECVD). Itshould also be noted that the ILD layer 105 may comprise a plurality ofdielectric layers.

A plurality of contacts (not separately illustrated) is formed throughthe ILD layer 105 to provide an electrical contact to the electricalcircuit 103. The contacts may be formed, for example, by usingphotolithography techniques to deposit and pattern a photoresistmaterial on the ILD layer 105 to expose portions of the ILD layer 105that are to become the contacts. An etch process, such as an anisotropicdry etch process, may be used to create openings in the ILD layer 105.The openings may be lined with a diffusion barrier layer and/or anadhesion layer (not shown), and filled with a conductive material. Thediffusion barrier layer comprises one or more layers of TaN, Ta, TiN,Ti, Co W, or the like, and the conductive material comprises copper,tungsten, aluminum, silver, and combinations thereof, or the like,thereby forming the contacts.

One or more additional inter-metal dielectric (IMD) layers 107 andinterconnect lines 109 form metallization layers over the ILD layer 105.Generally, the one or more additional IMD layers 107 and the associatedmetallization layers are used to interconnect the electrical circuits toeach other and to provide an external electrical connection. Theadditional IMD layers 107 may be formed of a low-K dielectric material,such as fluorosilicate glass (FSG) formed by PECVD techniques orhigh-density plasma chemical vapor deposition (HDPCVD) or the like, andmay include intermediate etch stop layers. External contacts (not shown)may be formed in an uppermost layer.

It should also be noted that one or more etch stop layers (notseparately illustrated) may be positioned between adjacent ones of theILD layers and the IMD layers, e.g., the ILD layer 105 and theadditional IMD layers 107. Generally, the etch stop layers provide amechanism to stop an etching process when forming vias and/or contacts.The etch stop layers are formed of a dielectric material having adifferent etch selectivity from adjacent layers, e.g., the underlyingsubstrate 101 and the overlying ILD layer 105 and additional IMD layers107. In an embodiment, etch stop layers may be formed of SiN, SiCN,SiCO, CN, combinations thereof, or the like, deposited by CVD or PECVDtechniques.

A first passivation layer 111 may be formed over the additional IMDlayers 107 and the interconnect lines 109. The first passivation layer111 may be a single layer or a composite layer, and may be formed of anon-porous material. In some embodiments, the first passivation layer111 may be un-doped silicate glass (USG). In accordance with otherembodiments, the first passivation layer 111 is formed of one or morelayers of silicon oxide (SiO_(x)), silicon nitride (SiN), siliconoxynitride, or the like. In still further embodiments, the firstpassivation layer 111 is formed of a polymer layer which may bepolybenzoxazole (PBO), although any suitable material, such as polyimideor a polyimide derivative, may alternatively be utilized. The firstpassivation layer 111 may be formed by CVD, PECVD, HDPCVD,sub-atmospheric chemical vapor deposition (SACVD), a spin-coatingprocess, or the like.

Metal pads 113 (including a first metal pad 113A, a second metal pad113B, and a third metal pad 113C, which are collectively referred to asmetal pads 113) are formed in the first passivation layer 111, and maybe electrically coupled to the electrical circuit 103, in accordancewith some exemplary embodiments. The metal pads 113 may be copper pads,aluminum pads, aluminum-copper pads, other metallic pads, or the like.

In some embodiments, a first hard mask layer is deposited over the firstpassivation layer 111 and the metal pads 113. The first hard mask layeris patterned to form a first hard mask 115 having openings 117 formedtherein. The openings 117 are disposed over and expose the first metalpad 113A and the third metal pad 113C. As illustrated in FIG. 1, thefirst hard mask 115 may cover the second metal pad 113B. In anembodiment, the first hard mask 115 is formed of silicon oxide(SiO_(x)); however, other materials such as silicon nitride (SiN), USG,oxides, oxynitrides, silicon carbide, combinations of these, or the likemay be used. The first hard mask 115 may be a single layer, or acomposite layer. The first hard mask 115 may be formed through a processsuch as CVD, although other processes, such as PECVD, low pressurechemical vapor deposition (LPCVD), spin-on coating, or the like, mayalternatively be utilized. The first hard mask 115 may have a thicknessT1 of between about 0.1 μm and about 2 μm, such as about 0.2 μm.

Referring to FIG. 2, an external connection material 201 is formed overthe first metal pad 113A and the third metal pad 113C. The externalconnection material 201 may be formed of copper (Cu), a copper alloy,gold (Au), a gold alloy, indium (In), solder, a solder alloy, or thelike. The external connection material 201 may have a width W1 ofbetween about 5 μm and about 50 μm, such as about 10 μm. The externalconnection material 201 may have a height H1 of between about 0.2 μm andabout 5 μm, such as about 0.6 μm. The external connection material 201may be spaced apart from sidewalls of the first hard mask 115 in theopenings 117, as illustrated in FIG. 2, or the external connectionmaterial 201 may contact sidewalls of the first hard mask 115.

In an embodiment in which the external connection material 201 comprisescopper, a seed layer (not separately illustrated) is formed over thefirst hard mask 115, the first metal pad 113A, and the third metal pad113C. In some embodiments, the seed layer is a metal layer, which may bea single layer or a composite layer comprising a plurality of sub-layersformed of different materials. In some embodiments, the seed layercomprises a titanium layer and a copper layer over the titanium layer.The seed layer may be formed using, for example, physical vapordeposition (PVD) or the like. A photoresist (not separately illustrated)is then formed and patterned on the seed layer. The photoresist may beformed by spin-coating or the like and may be exposed to light forpatterning. The pattern of the photoresist corresponds to the externalconnection material 201. The patterning forms openings through thephotoresist to expose the seed layer. A conductive material is formed inthe openings of the photoresist and on the exposed portions of the seedlayer. The conductive material may be formed by plating, such aselectroplating or electroless plating, or the like. The conductivematerial may comprise copper. Then, the photoresist and portions of theseed layer on which the conductive material is not formed are removed.The photoresist may be removed by an acceptable ashing or strippingprocess, such as using an oxygen plasma or the like. Once thephotoresist is removed, exposed portions of the seed layer are removed,such as by using an acceptable etching process, such as by wet or dryetching. The remaining portions of the seed layer and conductivematerial form the external connection material 201.

In embodiments in which the external connection material 201 comprises areflowable material, the reflowable material may be deposited in theopenings 117 and reflowed to form the external connection material 201.In some embodiments, the external connection material 201 may beprovided on a second wafer 300 (discussed in detail below) in additionto or instead of on the first wafer 100.

Referring to FIG. 3, a second wafer 300 is bonded to the first wafer100. In some embodiments, the second wafer 300 comprises surface-mountdevices (SMDs) or integrated passive devices (IPDs). The second wafer300 may include one or more individual component devices (as will bediscussed later). The second wafer 300 may include one or more diodes(such as light-emitting diodes (LEDs), laser diodes, photodiodes, or thelike), capacitors, power amplifiers (PAs), resistors, inductors, or thelike.

As illustrated in FIG. 3, the second wafer 300 includes a carriersubstrate 301, an adhesive layer 303, device layers 305, and bottomterminals 313. The device layers 305 may be attached to the carriersubstrate 301 through the adhesive layer 303. The bottom terminals 313may be disposed on a side of the device layers 305 opposite the carriersubstrate 301.

In some embodiments, the carrier substrate 301 may be formed of silicon(Si), germanium (Ge), silicon germanium (SiGe), and/or a III-V compoundsemiconductor such as gallium arsenide (GaAs), gallium arsenidephosphide (GaAsP), aluminum indium arsenide (AlInAs), aluminum galliumarsenide (AlGaAs), gallium indium arsenide (GalnAs), gallium indiumphosphide (GaInP), gallium indium arsenide phosphide (GaInAsP), or thelike. The carrier substrate 301 may be a glass carrier substrate, aceramic carrier substrate, or the like. The carrier substrate 301 may bea wafer, such that multiple packages can be formed on the carriersubstrate 301 simultaneously. The carrier substrate 301 may have athickness T3 of between about 50 μm and about 800 μm, such as about 200μm.

The adhesive layer 303 may be an etch stop layer. For example, thecarrier substrate 301 may be removed from the device layers 305 byperforming an etch process. The etch process may be a wet etch processand may remove the carrier substrate 301 from the adhesive layer 303.The adhesive layer 303 may then be removed from the device layers 305 byan additional etch process, such as a wet etch process.

In some embodiments, the adhesive layer 303 may be formed of apolymer-based material. In certain embodiments, the adhesive layer 303is an epoxy-based thermal-release material, which loses its adhesiveproperty when heated, such as a light-to-heat-conversion (LTHC) releasecoating. In other embodiments, the adhesive layer 303 may be anultra-violet (UV) glue, which loses its adhesive property when exposedto UV light. In embodiments in which the adhesive layer 303 is formed ofa LTHC release coating or a UV glue, the carrier substrate 301 may beremoved from the device layers 305 by exposing the adhesive layer 303 toheat or UV light, respectively. The adhesive layer 303 may be dispensedas a liquid and cured, may be a laminate film laminated onto the carriersubstrate 301, or may be the like. The top surface of the adhesive layer303 may be leveled and may have a high degree of co-planarity.

The device layers 305 may include various metal layers, dielectriclayers, and III-V epitaxial layers (i.e., semiconductive layers), whichmake up the various devices included in the second wafer 300. The devicelayers 305 may have a combined thickness T2 of between about 1 μm andabout 30 μm, such as about 10 μm.

In embodiments in which the second wafer 300 includes LEDs, the devicelayers 305 may include a p-type doped semiconductor layer 307, an n-typedoped semiconductor layer 309, and a multiple quantum well (MQW) 311.The n-type doped semiconductor layer 309 may be disposed adjacent to andin contact with the bottom terminals 313, as illustrated in FIG. 3. Inother embodiments, the p-type doped semiconductor layer 307 and then-type doped semiconductor layer 309 may be switched such that then-type doped semiconductor layer 309 is disposed adjacent to and incontact with the bottom terminals 313. The p-type doped semiconductorlayer 307 and the n-type doped semiconductor layer 309 may be configuredas a PN junction designed to emit light during operation.

In some embodiments, The MQW 311 includes a stack of two alternatingsemiconductor material films 315 and 317. In one embodiment, the twosemiconductor material films 315 and 317 include a layer of indiumgallium nitride (InGaN) and a layer of gallium nitride (GaN),respectively. Various semiconductor layers can be grown by properepitaxy growth technique. In one example, the epitaxial semiconductorlayers are deposited by metal organic chemical vapor deposition (MOCVD)or the like.

In embodiments in which the external connection material 201 comprises areflowable material, the second wafer 300 may be bonded to the firstwafer 100 by reflowing the external connection material 201 to formexternal connectors 319 which bond the first metal pad 113A and thethird metal pad 113C to the bottom terminals 313. In embodiments inwhich the external connection material 201 comprises copper, the secondwafer 300 may be bonded to the first wafer 100 by forming metal-to-metaldirect bonds between the external connection material 201 and the bottomterminals 313. As such, the bottom terminals 313 may be physicallybonded and electrically connected to the first metal pad 113A and thethird metal pad 113C through the bottom terminals 313. In someembodiments, the external connection material 201 may be omitted and thefirst metal pad 113A and the third metal pad 113C may be bonded to thebottom terminals 313 through direct metal-to-metal bonding (such ascopper-to-copper bonding or gold-to-gold bonding), hybrid bonding, orthe like. The first hard mask 115 may also be omitted. The bottomterminals 313 may have widths W2 of between about 3 μm and about 45 μm,such as about 8 μm.

Referring to FIG. 4, the carrier substrate 301 and the adhesive layer303 are removed from the second wafer 300. As discussed above, thecarrier substrate 301 and the adhesive layer 303 may be removed byperforming a first etch process and a second etch process, respectively,or by exposing the adhesive layer 303 to heat, UV light, or the like.

Referring to FIG. 5, a second hard mask layer is deposited over thesecond wafer 300 and patterned to form a second hard mask 501. Thesecond hard mask 501 may be formed of silicon nitride, silicon oxide, orthe like. The second hard mask 501 may be a single layer, or a compositelayer. The second hard mask 501 may be formed through a process such asCVD, although other processes, such as PECVD, LPCVD, spin-on coating, orthe like, may alternatively be utilized. The second hard mask may have athickness T4 of between about 0.2 μm and about 5 μm, such as about 2 μm.

Referring to FIG. 6, the p-type doped semiconductor layer 307, the MQW311, and the n-type doped semiconductor layer 309 of the device layers305 are etched to form a first component device 600A and a secondcomponent device 600B (collectively referred to as component devices600). The second hard mask 501 serves as a mask such that portions ofthe device layers 305 underlying the second hard mask 501 are notetched. The first hard mask 115 serves as an etch stop layer such thatportions of the first wafer 100 underlying the first hard mask 115 arenot etched. The device layers 305 may be etched, for example, by a dryetch process.

In embodiments in which the first component device 600A and the secondcomponent device 600B are formed, the second wafer 300 may include twoor more component devices. Each of the first component device 600A andthe second component device 600B may be a single-component device or amultiple-component device. In some embodiments, the first componentdevice 600A and the second component device 600B include one or morediodes (e.g., a light-emitting diode (LED), a laser diode, a photodiodeor the like), as illustrated in FIG. 6. In other embodiments, the firstcomponent device 600A and the second component device 600B may becapacitors, PAs, resistors, inductors, or the like therein, as describedabove in reference to the second wafer 300. In embodiments in which thecomponent devices 600 comprise LEDs, each of the component devices 600may include an n-type doped semiconductor layer 603, a MQW 605, and ap-type doped semiconductor layer 601 similar to the elements describedabove in reference to FIG. 3.

Referring to FIG. 7, a protection layer 701 is formed over the firstcomponent device 600A, the second component device 600B, the first hardmask 115, and the second hard mask 501. The protection layer 701 may bedeposited by atomic layer deposition (ALD), CVD, PECVD, LPCVD, aspin-coating process, or the like. As illustrated in FIG. 7, theprotection layer 701 may be formed conformally over the first componentdevice 600A, the second component device 600B, the first hard mask 115,and the second hard mask 501. The protection layer 701 may be formed ofa dielectric material. For example, the protection layer 701 may beformed of aluminum oxide (Al₂O₃), aluminum nitride (AlN), siliconnitride (SiN), silicon oxide (SiO_(x)), the like, or a combinationthereof. In other embodiments, the protection layer 701 is formed of apolymer layer which may be polybenzoxazole (PBO), although any suitablematerial, such as polyimide or a polyimide derivative, may alternativelybe utilized. The protection layer 701 may be a single layer or multiplelayers. According to some embodiments, the protection layer 701 isformed of a silicon oxide layer overlying a silicon nitride layer. Theprotection layer 701 may have a thickness T5 of between about 0.05 μmand about 0.2 μm, such as about 0.1 μm.

Referring to FIG. 8, a gap fill material 801 is formed over theprotection layer 701 and the gap fill material 801 is subsequentlyplanarized. In some embodiments, the gap fill material 801 is formed ofsilicon oxide (SiO_(x)). In other embodiments, the gap fill material 801is formed of silicon nitride (SiN) or the like. The gap fill material801 may be formed by CVD, PECVD, ALD, flowable chemical vapor deposition(FCVD), a spin-on process, or the like. The gap fill material 801 maythen be planarized by a process such as a chemical mechanical polishing(CMP). As illustrated in FIG. 8, the gap fill material 801 may beplanarized such that a top surface of the gap fill material 801 isdisposed above top surfaces of the second hard mask 501 over the firstcomponent device 600A and the second component device 600B.

Referring to FIG. 9, an opening 901 is formed in the gap fill material801. The opening 901 may be formed by depositing a photoresist (notseparately illustrated) over the gap fill material 801, patterning thephotoresist, and dry etching the gap fill material 801. The opening 901may extend down to the second metal pad 113B. In some embodiments, asillustrated in FIG. 9, the second metal pad 113B may be etched such thata recess is formed in the topmost surface of the second metal pad 113B.The recess may have a depth of between about 0.5 nm and about 50 nm,such as about 5 nm. The opening 901 may have a width W3 of between about0.5 μm and about 10 μm, such as about 1 μm. The opening 901 may have adepth D1 of between about 3 μm and about 25 μm, such as about 14 μm. Assuch, the opening 901 may have an aspect ratio of between about 1 andabout 12, such as about 5. The photoresist may be removed by stripping,ashing, or the like.

Referring to FIG. 10, a barrier layer 1001 is deposited over the gapfill material 801 and the second metal pad 113B and an electrodematerial 1003 is deposited over the barrier layer 1001. The barrierlayer 1001 may be formed of titanium (Ti), titanium nitride (TiN),tantalum nitride (TaN), combinations thereof, or the like. The barrierlayer 1001 may be a single layer or multiple layers. The electrodematerial 1003 may be formed of copper (Cu), tungsten (W), aluminum (Al),combinations thereof, or the like. The barrier layer 1001 may bedeposited by sputtering. The electrode material 1003 may be plated ontothe surface of the barrier layer 1001. The barrier layer 1001 may be ametal diffusion barrier and may prevent the diffusion of metals from theelectrode material 1003 into the gap fill material 801.

Referring to FIG. 11, the electrode material 1003 and the barrier layer1001 may be planarized to form a via 1101 and a barrier 1103. The via1101 may be used to connect a subsequently formed terminal (e.g., a topterminal 1301, discussed below in reference to FIG. 13) to the secondmetal pad 113B. As such, the via 1101 may be electrically connected tothe second metal pad 113B. Top surfaces of the via 1101 and the barrier1103 may be co-planar with a top surface of the gap fill material 801.The via 1101 and the barrier 1103 may be planarized using a CMP process.The gap fill material 801 may also be planarized by the CMP process.

Referring to FIG. 12, third openings 1201 are formed in the gap fillmaterial 801, the protection layer 701, and the second hard mask 501.The third openings 1201 expose the n-type doped semiconductor layer 603and may be provided in order to connect subsequently formed terminals(e.g., a top terminal 1301, discussed below in reference to FIG. 13) tothe component devices 600. The third openings 1201 may be formed bydepositing a photoresist (not separately illustrated) over the gap fillmaterial 801, the via 1101, and the barrier 1103. The photoresist isthen patterned and the gap fill material 801, the protection layer 701,and the second hard mask 501 etched by an etching process such as a dryetch. The gap fill material 801, the protection layer 701, and thesecond hard mask 501 may be dry etched by one or more dry etchingprocesses. The photoresist is then removed by stripping, ashing, or thelike.

Referring to FIG. 13, top terminals 1301 are formed over the firstcomponent device 600A and the second component device 600B. The topterminals 1301 may be formed of copper (Cu), titanium (Ti), platinum(Pt), silver (Ag), aluminum (Al), gold (Au), alloys thereof, or thelike. The top terminals 1301 may be formed by depositing a seed layer(not separately illustrated) over the gap fill material 801, theprotection layer 701, the second hard mask 501, and the componentdevices 600. In some embodiments, the seed layer is a metal layer, whichmay be a single layer or a composite layer comprising a plurality ofsub-layers formed of different materials. In some embodiments, the seedlayer comprises a titanium layer and a copper layer over the titaniumlayer. The seed layer may be formed using, for example, PVD or the like.A photoresist (not separately illustrated) is then formed and patternedon the seed layer. The photoresist may be formed by spin-coating or thelike and may be exposed to light for patterning. The pattern of thephotoresist corresponds to the top terminals 1301. The patterning formsopenings through the photoresist to expose the seed layer. A conductivematerial is formed in the openings of the photoresist and on the exposedportions of the seed layer. The conductive material may be formed byplating, such as electroplating or electroless plating, or the like. Theconductive material may comprise copper. Then, the photoresist andportions of the seed layer on which the conductive material is notformed are removed. The photoresist may be removed by an acceptableashing or stripping process, such as using an oxygen plasma or the like.Once the photoresist is removed, exposed portions of the seed layer areremoved, such as by using an acceptable etching process, such as by wetor dry etching. The remaining portions of the seed layer and conductivematerial form the top terminals 1301. In some embodiments, the topterminals 1301 may be formed by evaporation deposition.

In some embodiments, the top terminals 1301 include a first portion1301A and a second portion 1301B. The first portion 1301A may be formedin the third opening 1201 and may be disposed below a top surface of thegap fill material 801. The second portion 1301B may extend from thefirst portion 1301A over the gap fill material to the via 1101. Thefirst portion may be connected to the n-type doped semiconductor layers603 of the component devices 600. The first portion 1301A may include arecess 1303. FIG. 13 includes a top-down view of one of the topterminals 1301 including a recess 1303. As illustrated in FIG. 13, thefirst portion 1301A may have a ring shape, with a circular recess 1303disposed therein. In embodiments in which the component devices 600 areLEDs, laser diodes, or photo diodes, the recesses 1303 may allow lightto pass through the top terminals 1301 to/from the component devices600. In other embodiments, the recesses 1303 may be square, rectangular,polygonal, or any other suitable shape in top-down view. In embodimentsin which the first component device 303A and the second component device303B include capacitors, resistors, or the like, the top terminals 1301may extend completely across the bottom surfaces of the third openings1201.

The second portion 1301B may be physically and electrically connected tothe first portion 1301A and the via 1101 and may serve to electricallyconnect the first portion 1301A to the via 1101. The first portion 1301Aand the second portion 1301B may be formed simultaneously, or the firstportion 1301A and the second portion 1301B may be formed in a two-stepprocess in which the first portion 1301A is formed, then the secondportion 1301B is formed. Although not shown in FIG. 13, the secondcomponent device 600B may also be connected to the second metal pad 113Bor other metal pads through second portions 1301B of the top terminals1301, disposed into or out from the page, or in another direction.

Referring to FIG. 14, a second passivation layer 1401 may be depositedover the gap fill material 801, the top terminals 1301, the firstcomponent device 600A, and the second component device 600B. The secondpassivation layer 1401 may be formed of silicon nitride (SiN), siliconoxide (SiO_(x)), combinations or multiple layers thereof, or the like.In other embodiments, the second passivation layer 1401 is formed of apolymer layer which may be polybenzoxazole (PBO), although any suitablematerial, such as polyimide or a polyimide derivative, may alternativelybe utilized. The second passivation layer 1401 may be formed of amaterial that is optically transparent to certain wavelengths of light.For example, in embodiments in which the first component device 600A andthe second component device 600B are LEDs, laser diodes, photo diodes,or the like, the second passivation layer 1401 may be formed of amaterial that is optically transparent to light of the wavelengthproduced or received by the component devices 600.

According to various embodiments, the bottom terminals 313 of the firstcomponent device 600A and the second component device 600B may beconnected to the first wafer 100 directly by metal-to-metal bonding orhybrid bonding or through the external connectors 319, by solderbonding, metal-to-metal bonding, or by hybrid bonding. The top terminals1301 of the first component device 600A and the second component device600B may be connected to the first wafer 100 through the via 1101. Thismay allow for component devices having small widths to be connected to awafer. For example, component devices having widths of less than 50 μm,such as 10 μm to 50 μm, may be connected to the wafer. Moreover, themethods and devices of the present disclosure provide better integrationfor use in silicon. Additionally, multiple component devices on a singlechip may be bonded to a wafer and processed simultaneously. Furthermore,the vias may be formed extending to the same metal layer on which thecomponent devices are to bonded, reducing manufacturing costs.

FIGS. 15 through 23 illustrate the cross-sectional views of intermediatestages in the formation of a package in accordance with some embodimentsof the present disclosure.

FIG. 15 illustrates a cross-sectional view of a first wafer 100, inaccordance with another embodiment. The first wafer 100 may be the sameas or similar to the first wafer 100 of the first embodiment,illustrated in FIG. 1. For example, the first wafer 100 may include asubstrate 101, an electrical circuit 103, an ILD layer 105, additionalIMD layers 107, interconnect lines 109, a first passivation layer 111, afirst metal pad 113A, a second metal pad 113B, and a third metal pad113C (collectively referred to as metal pads 113).

A first hard mask layer is deposited over the first passivation layer111 and the metal pads 113. The first hard mask layer is patterned toform a first hard mask 1501 having openings formed therein. The openingsare disposed over and expose portions of the first metal pad 113A andthe third metal pad 113C. In some embodiments, the openings may beformed to expose entire top surfaces of the first metal pad 113A and thethird metal pad 113C. In other embodiments, the openings may be formedto expose top surfaces of the first metal pad 113A, the third metal pad113C, and portions of the first passivation layer 111. The first hardmask 1501 may cover the second metal pad 113B. In an embodiment, thefirst hard mask 1501 is formed of silicon oxide; however, othermaterials such as silicon nitride, oxides, oxynitrides, silicon carbide,combinations of these, or the like may be used. The first hard mask 1501may be a single layer, or a composite layer. The first hard mask 1501may be formed through a process such as CVD, although other processes,such as PECVD, LPCVD, spin-on coating, or the like, may alternatively beutilized. The first hard mask 1501 may have a thickness T6 of betweenabout 0.1 μm and about 2 μm, such as about 0.2 μm.

An external connection material 1503 is formed over the first metal pad113A and the third metal pad 113C. The external connection material 1503may be formed of copper (Cu), a copper alloy, gold (Au), a gold alloy,indium (In), solder, a solder alloy, or the like. The externalconnection material 1503 may have a width W4 of between about 5 μm andabout 50 μm, such as about 10 μm. The external connection material 1503may have a height H2 of between about 0.2 μm and about 5 μm, such asabout 0.6 μm. The external connection material 1503 may be deposited inthe openings formed in the first hard mask 1501 and may contactsidewalls of the first hard mask 1501. In other embodiments, theexternal connection material 1503 may be spaced apart from the sidewallsof the first hard mask 1501. The external connection material 1503 mayextend over at least a portion of the first hard mask 1501.

In an embodiment in which the external connection material 1503comprises copper, a seed layer (not separately illustrated) is formedover the first hard mask 115, the first metal pad 113A, and the thirdmetal pad 113C. In some embodiments, the seed layer is a metal layer,which may be a single layer or a composite layer comprising a pluralityof sub-layers formed of different materials. In some embodiments, theseed layer comprises a titanium layer and a copper layer over thetitanium layer. The seed layer may be formed using, for example,physical vapor deposition (PVD) or the like. A photoresist (notseparately illustrated) is then formed and patterned on the seed layer.The photoresist may be formed by spin-coating or the like and may beexposed to light for patterning. The pattern of the photoresistcorresponds to the external connection material 1503. The patterningforms openings through the photoresist to expose the seed layer. Aconductive material is formed in the openings of the photoresist and onthe exposed portions of the seed layer. The conductive material may beformed by plating, such as electroplating or electroless plating, or thelike. The conductive material may comprise copper. Then, the photoresistand portions of the seed layer on which the conductive material is notformed are removed. The photoresist may be removed by an acceptableashing or stripping process, such as using an oxygen plasma or the like.Once the photoresist is removed, exposed portions of the seed layer areremoved, such as by using an acceptable etching process, such as by wetor dry etching. The remaining portions of the seed layer and conductivematerial form the external connection material 1503.

In embodiments in which the external connection material 1503 comprisesa reflowable material, the reflowable material may be deposited in theopenings and reflowed to form the external connection material 1503. Insome embodiments, the external connection material 1503 may be providedon component devices 1600 (discussed in detail below) in addition to orinstead of on the first wafer 100.

Referring to FIG. 16, a first component device 1600A and a secondcomponent device 1600B (collectively referred to as the componentdevices 1600) are bonded to the first wafer 100. The component devices1600 may be referred to as SMDs, or IPDs. The component devices 1600 mayinclude one or more diodes (such as LEDs, laser diodes, photodiodes, orthe like), capacitors, PAs, resistors, inductors, or the like.

The component devices 1600 may be the same as, or similar to thecomponent devices 600, described above in reference to FIG. 6. Each ofthe component devices 1600 may include a top terminal 1607, an n-typedoped semiconductor layer 1601, an MQW 1603, a p-type dopedsemiconductor layer 1605, and a bottom terminal 1609. The n-type dopedsemiconductor layer 1601, the MQW 1603, and the p-type dopedsemiconductor layer 1605 may have a combined thickness T7 of betweenabout 1 μm and about 30 μm, such as about 10 μm. The MQW 1603 includes astack of two alternating semiconductor material films 1611 and 1613.

The top terminals 1607 may be used to connect the component devices 1600to the second metal pad 113B (as described later in reference to FIG.22) and the bottom terminals 1609 may be used to connect the componentdevices to the first metal pad 113A and the third metal pad 113C. Thetop terminals 1607 and the bottom terminals 1609 may be disposed atdifferent planes. For example, the top terminals 1607 may be disposed attop surfaces of the component devices 1600 and the bottom terminals 1609may be disposed at bottom surfaces of the component devices 1600. Thebottom terminals 1609 may have widths W5 of between about 3 μm and about45 μm, such as about 8 μm.

FIG. 16 includes a top-down view of the first component device 1600A. Asillustrated in FIG. 16, the top terminal 1607 of the first componentdevice 1600A may have a ring-shape in the top-down view. In embodimentsin which the component devices 1600 are LEDs, laser diodes, or photodiodes, the ring-shaped top terminal 1607 may allow light to passthrough the top terminals 1607 to/from the component devices 1600. Inother embodiments, the top terminals 1607 may be square, rectangular,polygonal, or any other suitable shape in the top-down view and recessesformed in the top terminals 1607 may be shaped accordingly. Inembodiments in which the component devices 1600 include capacitors,resistors, or the like, the top terminals 1607 be solid or continuouswithout a recess formed therein and may be circular, oval, square,rectangular, polygonal, or have any other suitable shape in the top-downview.

In embodiments in which the external connection material 1503(illustrated in FIG. 15) comprises a reflowable material, the componentdevices 1600 may be bonded to the first wafer 100 by reflowing theexternal connection material 1503 to form external connectors 1615 whichbond the bottom terminals 1609 of the first component device 1600A andthe second component device 1600B to the first metal pad 113A and thethird metal pad 113C, respectively. In embodiments in which the externalconnection material 1503 comprises copper, the component devices 1600may be bonded to the first wafer 100 by forming metal-to-metal directbonds between the external connection material 1503 and the bottomterminals 1609. As such, the bottom terminals 1609 may be physicallybonded and electrically connected to the first metal pad 113A and thethird metal pad 113C through the bottom terminals 1609. In someembodiments, the external connection material 1503 may be omitted andthe first metal pad 113A and the third metal pad 113C may be bonded tothe bottom terminals 1609 through direct metal-to-metal bonding (such ascopper-to-copper bonding or gold-to-gold bonding), hybrid bonding, orthe like. The first hard mask 1501 may also be omitted.

Referring to FIG. 17, a protection layer 1701 is formed over the firstcomponent device 1600A, the second component device 1600B, the externalconnectors 1615, and the first hard mask 1501. The protection layer 1701may be deposited by ALD, CVD, PECVD, LPCVD, or the like. As illustratedin FIG. 17, the protection layer 1701 may be formed conformally over thefirst component device 1600A, the second component device 1600B, theexternal connectors 1615, and the first hard mask 1501. The protectionlayer 1701 may be formed of a dielectric material. For example, theprotection layer 1701 may be formed of aluminum oxide (Al₂O₃), aluminumnitride (AlN), silicon nitride (SiN), silicon oxide (SiO_(x)), the like,or a combination thereof. The protection layer 1701 may be a singlelayer or multiple layers. According to some embodiments, the protectionlayer 1701 is formed of a silicon oxide layer overlying a siliconnitride layer. The protection layer 1701 may have a thickness T8 ofbetween about 0.05 μm and about 0.2 μm, such as about 0.1 μm.

Referring to FIG. 18, a gap fill material 1801 is formed over theprotection layer 1701 and the gap fill material 1801 is subsequentlyplanarized. In some embodiments, the gap fill material 1801 is formed ofsilicon oxide (SiO_(x)). In other embodiments, the gap fill material1801 is formed of silicon nitride (SiN) or the like. The gap fillmaterial 1801 may be formed by CVD, PECVD, ALD, FCVD, a spin-on process,or the like. The gap fill material 1801 may be planarized by a CMPprocess. As illustrated in FIG. 18, the gap fill material 1801 may beplanarized such that a top surface of the gap fill material 1801 isdisposed above top surfaces of the top terminals 1607.

Referring to FIG. 19, an opening 1901 is formed in the gap fill material1801. The opening 1901 may be formed by depositing a photoresist (notseparately illustrated) over the gap fill material 1801, patterning thephotoresist, and dry etching the gap fill material 1801. The opening1901 may extend down to the second metal pad 113B. In some embodiments,as illustrated in FIG. 19, the second metal pad 113B may be etched suchthat a recess is formed in the topmost surface of the second metal pad113B. The recess may have a depth D3 of between about 0.5 nm and about50 nm, such as about 5 nm. The opening 1901 may have a width W6 ofbetween about 0.5 μm and about 10 μm, such as about 1 μm. The opening1901 may have a depth D2 of between about 3 μm and about 25 μm, such asabout 14 μm. As such, the opening 1901 may have an aspect ratio ofbetween about 1 and about 12, such as about 5. The photoresist may beremoved by stripping, ashing, or the like.

Referring to FIG. 20, a barrier layer is deposited over the gap fillmaterial 1801 and the second metal pad 113B and a conductive fillmaterial is deposited over the barrier layer. The barrier layer may beformed of titanium (Ti), titanium nitride (TiN), tantalum nitride (TaN),combinations thereof, or the like. The barrier layer may be a singlelayer or multiple layers. The conductive fill material may be formed ofcopper (Cu), tungsten (W), aluminum (Al), combinations thereof, or thelike. The barrier layer may be deposited by sputtering. The electrodematerial may be plated onto the surface of the barrier layer. Thebarrier layer may be a metal diffusion barrier and may prevent thediffusion of metals from the conductive fill material into the gap fillmaterial 1801.

After the barrier layer and the conductive fill material are deposited,the conductive fill material, the barrier layer, and the gap fillmaterial 801 are planarized to form a conductive via 2001 having abarrier 2003. The conductive fill material, the barrier layer, and thegap fill material 1801 may be planarized by a CMP process or the like.Following the planarization, top surfaces of the conductive via 2001,the barrier 2003, and the gap fill material 1801 may be co-planar. Theconductive via 2001 may be used to connect the top terminals 1607 to thesecond metal pad 113B. As such, the conductive via 2001 may beelectrically connected to the second metal pad 113B.

Referring to FIG. 21, first openings 2101 are formed in the gap fillmaterial 1801 and the protection layer 1701. The first openings 2101expose the n-type doped semiconductor layers 1601 and the top terminals1607 of the first component device 1600A and the second component device1600B and may be provided in order to connect the top terminals 1607 tothe second metal pad 113B through the conductive via 2001. The firstopenings 2101 may be formed by depositing a photoresist (not separatelyillustrated) over the gap fill material 1801, the conductive via 2001,and the barrier 2003. The photoresist is patterned and dry etchprocesses are used to remove portions of the gap fill material 1801 andthe protection layer 1701. The gap fill material 1801 and the protectionlayer 1701 may be etched by one dry etch process or multiple dry etchprocesses. The first openings may extend to top surfaces of thecomponent devices 1600. As such, portions of the top surfaces ofcomponent devices 1600, side surfaces of the top terminals 1607, and topsurfaces of the top terminals 1607 may be exposed. The photoresist isremoved by stripping, ashing, or the like.

Referring to FIG. 22, redistribution lines 2201 are formed over thefirst component device 1600A and the second component device 1600B. Theredistribution lines 2201 may be formed of copper (Cu), titanium (Ti),platinum (Pt), silver (Ag), aluminum (Al), gold (Au), alloys thereof, orthe like. The redistribution lines 2201 may be formed by depositing aseed layer (not separately illustrated) over the gap fill material 1801,the protection layer 1701, and the component devices 1600. In someembodiments, the seed layer is a metal layer, which may be a singlelayer or a composite layer comprising a plurality of sub-layers formedof different materials. In some embodiments, the seed layer comprises atitanium layer and a copper layer over the titanium layer. The seedlayer may be formed using, for example, PVD or the like. A photoresist(not separately illustrated) is then formed and patterned on the seedlayer. The photoresist may be formed by spin-coating or the like and maybe exposed to light for patterning. The pattern of the photoresistcorresponds to the redistribution lines 2201. The patterning formsopenings through the photoresist to expose the seed layer. A conductivematerial is formed in the openings of the photoresist and on the exposedportions of the seed layer. The conductive material may be formed byplating, such as electroplating or electroless plating, or the like. Theconductive material may comprise copper. Then, the photoresist andportions of the seed layer on which the conductive material is notformed are removed. The photoresist may be removed by an acceptableashing or stripping process, such as using an oxygen plasma or the like.Once the photoresist is removed, exposed portions of the seed layer areremoved, such as by using an acceptable etching process, such as by wetor dry etching. The remaining portions of the seed layer and conductivematerial form the redistribution lines 2201. In some embodiments, theredistribution lines 2201 may be formed by evaporation deposition.

As illustrated in FIG. 22, the redistribution lines 2201 may be formedover portions of the component devices 1600 such that at least a portionof the component devices are exposed. The exposed portions of thecomponent devices 1600 may have a circular shape, a square shape, arectangular shape, an oval shape, another polygonal shape, or any othersuitable shape in a top-down view. In embodiments in which the componentdevices 1600 include LEDs, laser diodes, or photodiodes, the exposedportions of the component devices 1600 may allow for light to pass to orfrom the diodes of the component devices. In other embodiments, theredistribution lines 2201 may be deposited across the entire exposed topsurfaces of the component devices 1600.

The redistribution lines 2201 may connect one or more of the componentdevices 1600 to the second metal pad 103B through the conductive via2001. For example, as illustrated in FIG. 22, the redistribution line2201 is physically and electrically connected to the top terminals ofthe first component device 1600A and the conductive via 2001. Theconductive via 2001 is physically and electrically connected to thesecond metal pad 103B. The second component device 1600B may beconnected to additional conductive vias (not separately illustrated) bythe redistribution lines 2201.

Referring to FIG. 23, a second passivation layer 2301 may be depositedover the gap fill material 1801, the redistribution lines 2201, and thecomponent devices 1600. The second passivation layer 2301 may be formedof silicon nitride (SiN), silicon oxide (SiO_(x)), combinations ormultiple layers thereof, or the like. The second passivation layer 2301may be formed of a material that is optically transparent to certainwavelengths of light. For example, in embodiments in which the componentdevices 1600 include LEDs, laser diodes, or photo diodes, the secondpassivation layer 2301 may be formed of a material that is opticallytransparent to light of a wavelength produced or received by the diodes.

According to various embodiments, the bottom terminals 1609 of thecomponent devices 1600 may be connected to the first wafer 100 throughthe external connectors 1615, by metal-to-metal bonding, or by hybridbonding. The top terminals 1607 of the component devices 1600 may beconnected to the first wafer 100 through the redistribution lines 2201and the conductive via 2001. This may allow for component devices havingsmall widths to be connected to a wafer. For example, component deviceshaving widths of less than 50 μm, such as 10 μm to 50 μm, may beconnected to the wafer. Moreover, the methods and devices of the presentdisclosure provide better integration for use in silicon. Additionally,individual component devices may be bonded to a wafer and processedsimultaneously. Furthermore, the vias may be formed extending to thesame metal layer on which the component devices are to bonded, reducingmanufacturing costs.

In accordance with an embodiment, a method includes bonding a firstterminal and a second terminal of a first substrate to a third terminaland a fourth terminal of a second substrate; separating the firstsubstrate to form a first component device and a second componentdevice; forming a gap fill material over the first component device, thesecond component device, and the second substrate; forming a conductivevia extending from a top surface of the gap fill material to a fifthterminal of the second substrate; and forming a top terminal over a topsurface of the first component device, the top terminal connecting thefirst component device to the fifth terminal of the second substratethrough the conductive via. In an embodiment, separating the firstsubstrate includes depositing a first hard mask over a top surface ofthe first substrate; patterning the first hard mask to form a firstportion and a second portion; and etching the first substrate to formthe first component device and the second component device using thefirst portion and the second portion as a mask. In an embodiment,forming the gap fill material includes depositing the gap fill materialover the first component device, the second component device, and thesecond substrate; and planarizing the gap fill material such that a topsurface of the gap fill material is disposed above a top surface of thefirst component device and a top surface of the second component device.In an embodiment, the first substrate includes a carrier substrate andone or more device layers, and the method further includes afterbonding, removing the carrier substrate from the one or more devicelayers. In an embodiment, the method further includes depositing aprotection layer over the first component device, the second componentdevice, and the semiconductor substrate, the gap fill material beingformed over the protection layer. In an embodiment, the protection layeris formed by atomic layer deposition (ALD) or chemical vapor deposition(CVD). In an embodiment, forming the conductive via includes etching thegap fill material to form an opening extending to the fifth terminal ofthe second substrate; depositing a barrier layer over the gap fillmaterial and the second substrate; depositing a conductive fill materialover the barrier layer; and planarizing the barrier layer, theconductive fill material, and the gap fill material. In an embodiment,the method further includes forming a first hard mask over the secondsubstrate, the first hard mask being disposed between the firstsubstrate and the second substrate, and forming the conductive viafurther includes etching the first hard mask to form the openingextending to the fifth terminal of the second substrate.

In another embodiment, a method includes bonding a bottom terminal of acomponent device to a first metal pad on a first substrate; depositing aprotection layer over the first substrate and the component device;depositing a gap fill material over the protection layer; forming afirst opening through the gap fill material and the protection layer,the first opening exposing a second metal pad on the first substrate;forming a conductive via in the first opening, the conductive via beingconnected to the second metal pad; forming a second opening through theprotection layer and the gap fill material, the second opening exposinga portion of a top surface of the component device; and forming a topterminal over the top surface of the component device, the top terminalconnecting the component device to the conductive via. In an embodiment,bonding the bottom terminal to the first metal pad includes solderbonding the bottom terminal to the first metal pad. In an embodiment,bonding the bottom terminal to the first metal pad includes directmetal-to-metal bonding the bottom terminal to the first metal pad. In anembodiment, the method further includes forming a passivation layer overthe top terminal, the passivation layer contacting the gap fillmaterial, the top terminal, and the top surface of the component device.In an embodiment, forming the conductive via includes depositing abarrier layer over the gap fill material and the second metal pad;depositing a conductive fill material over the barrier layer; andplanarizing the barrier layer and the conductive fill material. In anembodiment, the method further includes forming a first hard mask overthe semiconductor substrate, and bonding the bottom terminal to thefirst metal pad includes patterning the first hard mask to form a thirdopening, the third opening exposing the first metal pad; forming asolder bump over the first metal pad; and reflowing the solder bump toform a solder joint, wherein the bottom terminal is bonded to the firstmetal pad through the solder joint. In an embodiment, depositing theprotection layer includes conformally depositing the protection layer byatomic layer deposition (ALD) or chemical vapor deposition (CVD).

In accordance with yet another an embodiment, a device includes a firstmetal pad and a second metal pad on a substrate; a component device overthe first metal pad, the component device including a bottom terminaland a top terminal disposed on opposite sides of the component device,the bottom terminal electrically coupling the component device to thefirst metal pad; a gap fill material surrounding the component device; aconductive via over the second metal pad, the conductive via extendingthrough the gap fill material to the second metal pad, wherein a topsurface of the gap fill material is level with a top surface of theconductive via; and an interconnect electrically coupling the topterminal of the component device to the conductive via. In anembodiment, the component device is a diode, and at least a portion of atop surface of the component device is exposed through the top terminal.In an embodiment, the component device has a width of between about 10μm and about 50 μm. In an embodiment, a bottom surface of the conductivevia is disposed below a bottom surface of the bottom terminal. In anembodiment, the bottom terminal is bonded to the first metal pad by ametal-to-metal bond.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: bonding a first terminal anda second terminal of a first substrate to a third terminal and a fourthterminal of a second substrate; separating the first substrate to form afirst component device and a second component device; forming a gap fillmaterial over the first component device, the second component device,and the second substrate; forming a conductive via extending from a topsurface of the gap fill material to a fifth terminal of the secondsubstrate; and forming a top terminal over a top surface of the firstcomponent device, the top terminal connecting the first component deviceto the fifth terminal of the second substrate through the conductivevia.
 2. The method of claim 1, wherein separating the first substratecomprises: depositing a first hard mask over a top surface of the firstsubstrate; patterning the first hard mask to form a first portion and asecond portion; and etching the first substrate to form the firstcomponent device and the second component device using the first portionand the second portion as a mask.
 3. The method of claim 1, whereinforming the gap fill material comprises: depositing the gap fillmaterial over the first component device, the second component device,and the second substrate; and planarizing the gap fill material suchthat a top surface of the gap fill material is disposed above a topsurface of the first component device and a top surface of the secondcomponent device.
 4. The method of claim 1, wherein the first substratecomprises a carrier substrate and one or more device layers, the methodfurther comprising: after bonding, removing the carrier substrate fromthe one or more device layers.
 5. The method of claim 1, furthercomprising depositing a protection layer over the first componentdevice, the second component device, and the second substrate, whereinthe gap fill material is formed over the protection layer.
 6. The methodof claim 5, wherein the protection layer is formed by atomic layerdeposition (ALD) or chemical vapor deposition (CVD).
 7. The method ofclaim 1, wherein forming the conductive via comprises: etching the gapfill material to form an opening extending to the fifth terminal of thesecond substrate; depositing a barrier layer over the gap fill materialand the second substrate; depositing a conductive fill material over thebarrier layer; and planarizing the barrier layer, the conductive fillmaterial, and the gap fill material.
 8. The method of claim 7, furthercomprising forming a first hard mask over the second substrate, whereinthe first hard mask is disposed between the first substrate and thesecond substrate, and wherein forming the conductive via furthercomprises etching the first hard mask to form the opening extending tothe fifth terminal of the second substrate.
 9. A method comprising:bonding a bottom terminal of a component device to a first metal pad ona first substrate; depositing a protection layer over the firstsubstrate and the component device; depositing a gap fill material overthe protection layer; forming a first opening through the gap fillmaterial and the protection layer, the first opening exposing a secondmetal pad on the first substrate; forming a conductive via in the firstopening, the conductive via being connected to the second metal pad;forming a second opening through the protection layer and the gap fillmaterial, the second opening exposing a portion of a top surface of thecomponent device; and forming a top terminal over the top surface of thecomponent device, the top terminal connecting the component device tothe conductive via.
 10. The method of claim 9, wherein bonding thebottom terminal to the first metal pad comprises solder bonding thebottom terminal to the first metal pad.
 11. The method of claim 9,wherein bonding the bottom terminal to the first metal pad comprisesdirect metal-to-metal bonding the bottom terminal to the first metalpad.
 12. The method of claim 9, further comprising forming a passivationlayer over the top terminal, wherein the passivation layer contacts thegap fill material, the top terminal, and the top surface of thecomponent device.
 13. The method of claim 9, wherein forming theconductive via comprises: depositing a barrier layer over the gap fillmaterial and the second metal pad; depositing a conductive fill materialover the barrier layer; and planarizing the barrier layer and theconductive fill material.
 14. The method of claim 9, further comprisingforming a first hard mask over the first substrate, wherein bonding thebottom terminal to the first metal pad comprises: patterning the firsthard mask to form a third opening, the third opening exposing the firstmetal pad; forming a solder bump over the first metal pad; and reflowingthe solder bump to form a solder joint, wherein the bottom terminal isbonded to the first metal pad through the solder joint.
 15. The methodof claim 9, wherein depositing the protection layer comprisesconformally depositing the protection layer by atomic layer deposition(ALD) or chemical vapor deposition (CVD).
 16. A device comprising: afirst metal pad and a second metal pad on a substrate; a componentdevice over the first metal pad, the component device comprising abottom terminal and a top terminal disposed on opposite sides of thecomponent device, the bottom terminal electrically coupling thecomponent device to the first metal pad; a gap fill material surroundingthe component device; a conductive via over the second metal pad, theconductive via extending through the gap fill material to the secondmetal pad, wherein a top surface of the gap fill material is level witha top surface of the conductive via; and an interconnect electricallycoupling the top terminal of the component device to the conductive via.17. The device of claim 16, wherein the component device is a diode, andwherein at least a portion of a top surface of the component device isexposed through the top terminal.
 18. The device of claim 16, whereinthe component device has a width of between about 10 μm and about 50 μm.19. The device of claim 16, wherein a bottom surface of the conductivevia is disposed below a bottom surface of the bottom terminal.
 20. Thedevice of claim 16, wherein the bottom terminal is bonded to the firstmetal pad by a metal-to-metal bond.